Methods of greytone imprint lithography to fabricate optical devices

ABSTRACT

A method of imprinting a pattern on a substrate is provided. The method includes forming a first pattern on a plurality of masters using a method other than imprinting, the first pattern including a plurality of patterned features of varying sizes; measuring the patterned features at a plurality of locations on each of the masters; selecting a first master of the plurality of masters based on the measurements of the patterned features on each of the masters; using the first master to form a second pattern on an imprint template; and imprinting the first pattern on a first device with the imprint template.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional PatentApplication No. 63/186,319, filed on May 10, 2021, the contents of whichare herein incorporated by reference.

BACKGROUND Field

Embodiments of the present disclosure generally relate to opticaldevices for augmented, virtual, and mixed reality. More specifically,embodiments described herein provide for methods of fabricating opticaldevices via greytone imprint lithography.

Description of the Related Art

Virtual reality is generally considered to be a computer-generatedsimulated environment in which a user has an apparent physical presence.A virtual reality experience can be generated in 3D and viewed with ahead-mounted display (HMD), such as glasses or other wearable displaydevices that have near-eye display panels as lenses to display a virtualreality environment that replaces an actual environment.

Augmented reality, however, enables an experience in which a user canstill see through the display lenses of the glasses or other HMD device,or handheld device, to view the surrounding environment, yet also seeimages of virtual objects that are generated in the display and appearas part of the environment. Augmented reality can include any type ofinput, such as audio and haptic inputs, as well as virtual images,graphics, and video that enhances or augments the environment that theuser experiences. As an emerging technology, there are many challengesand design constraints with augmented reality.

One such challenge is displaying a virtual image overlayed on an ambientenvironment. Optical devices are used to assist in overlaying images.Generated light is propagated through a waveguide until the light exitsthe waveguide and is overlayed on the ambient environment. Fabricatingoptical devices can be challenging as optical devices tend to havenon-uniform properties. Accordingly, improved systems and method offabricating optical devices are needed in the art.

SUMMARY

In one embodiment, a method of imprinting a pattern on a substrate isprovided. The method includes forming a first pattern on a plurality ofmasters using a method other than imprinting, the first patternincluding a plurality of patterned features of varying sizes; measuringthe patterned features at a plurality of locations on each of themasters; selecting a first master of the plurality of masters based onthe measurements of the patterned features on each of the masters; usingthe first master to form a second pattern on an imprint template; andimprinting the first pattern on a first device with the imprinttemplate. a method of imprinting a pattern on a substrate is provided.The method includes forming a first pattern on a plurality of die oneach of a plurality of masters using a method other than imprinting, thefirst pattern on each die including a plurality of patterned features ofvarying sizes; measuring the patterned features at a plurality oflocations on each die on each of the masters; selecting a first die on afirst master of the plurality of masters based on the measurements ofthe patterned features on each die of each of the masters; using thefirst die on the first master to form a second pattern on an imprinttemplate; and imprinting the first pattern on a first die of a firstdevice with the imprint template. a method of imprinting a pattern on asubstrate is provided. The method includes forming a first pattern on aplurality of die on each of a plurality of masters using a method otherthan imprinting, the first pattern on each die including a plurality ofpatterned features of varying sizes; measuring the patterned features ata plurality of locations on each die on each of the masters; selecting afirst die on a first master of the plurality of masters based on themeasurements of the patterned features on each die of each of themasters; using the first die on the first master to form a secondpattern on a first imprint template; imprinting the first pattern oneach die of a plurality of die of a new master with the first imprinttemplate; using the plurality of die on the new master to form thesecond pattern on each die of a plurality of die on a second imprinttemplate; and imprinting the first pattern on a plurality of die on afirst device with the second imprint template.

BRIEF DESCRIPTION OF THE DRAWINGS

So that the manner in which the above recited features of the presentdisclosure can be understood in detail, a more particular description ofthe disclosure, briefly summarized above, may be had by reference toembodiments, some of which are illustrated in the appended drawings. Itis to be noted, however, that the appended drawings illustrate onlyexemplary embodiments and are therefore not to be considered limiting ofits scope, and may admit to other equally effective embodiments.

FIG. 1 is a process flow diagram of a method of imprinting a pattern onthe optical device shown in FIG. 2I, according to one embodiment.

FIGS. 2A-2I show different stages of the method of FIG. 1 for formingthe pattern on the optical device shown in FIG. 2I.

FIG. 3 is a process flow diagram of a method of imprinting a pattern onthe optical device shown in FIG. 4I, according to one embodiment.

FIGS. 4A-4I show different stages of the method of FIG. 3 for formingthe pattern on the optical device shown in FIG. 4I.

FIG. 5 is a process flow diagram of a method of imprinting a pattern onthe optical device shown in FIG. 6H, according to one embodiment.

FIGS. 6A-6H show different stages of the method of FIG. 5 for formingthe pattern on the optical device shown in FIG. 6H.

FIG. 7 is a process flow diagram of a method of imprinting a pattern onthe optical device shown in FIG. 8N, according to one embodiment.

FIGS. 8A-8N show different stages of the method of FIG. 7 for formingthe pattern on the optical device of FIG. 8N.

To facilitate understanding, identical reference numerals have beenused, where possible, to designate identical elements that are common tothe figures. It is contemplated that elements and features of oneembodiment may be beneficially incorporated in other embodiments withoutfurther recitation.

DETAILED DESCRIPTION

Embodiments described herein relate to for methods of fabricatingoptical devices via greytone imprint lithography. Greytone imprintlithography is different than greytone photolithography. As described indetail below, greytone imprint lithography uses imprint templates havingpatterned features of varying sizes (e.g., structures having varyingdepths and/or widths) to imprint corresponding patterned features on animprint resist layer disposed on a substrate. The imprint templates canbe used repeatedly to form the same patterned features on numeroussubstrates, for example during the manufacturing of optical devices,such as during the forming of optical gratings for waveguide combinersused for augmented reality applications.

On the other hand, greytone photolithography uses radiation (e.g.,visible light, UV light, etc.) instead of imprinting to form patternedfeatures having varying sizes (e.g., structures having varying depthsand/or widths). For example, a greytone mask can be used to vary theamount of radiation that different portions of a photoresist are exposedto during a greytone photolithography process. This varied amount ofradiation across the substrate physically alters the photoresist (e.g.,changes the solubility with respect to a developer) to different depthsand/or widths across the substrate. After the radiation exposure, thephotoresist can be developed and subsequently processed to formpatterned features having varying sizes (e.g., heights and widths)across the surface of a substrate. Although greytone photolithographycan be useful for forming structures having varying depths and/orwidths, it has been a challenge to obtain consistent results usinggreytone photolithography. The following disclosure provides solutionsto this problem of inconsistent results for greytone photolithography byinstead using a process that combines greytone photolithography withimprint lithography. This combination of greytone photolithography withimprint lithography can be referred to as greytone imprint lithography.

FIG. 1 is a process flow diagram of a method 1000 of imprinting apattern on the optical device 120 shown in FIG. 2I, according to oneembodiment. FIGS. 2A-2I show different stages of the method 1000 forforming the pattern on the optical device 120. The method 1000 isdescribed with reference to FIG. 1 and FIGS. 2A-2I.

At block 1002, with reference to FIG. 2A, a greytone photoresist layer103 is applied over a dielectric layer 102 of a master 100 (alsoreferred to as master substrate). The dielectric layer 102 can bedisposed over a substrate 101 of the master 100. In some embodiments,the substrate 101 can be formed of silicon, quartz, or any othermaterial commonly used for semiconductor substrates or optical devicesubstrates. In some embodiments, the dielectric layer 102 can be formedof silicon oxide or other dielectric material.

At block 1004, with reference to FIG. 2B, a greytone photolithographyprocess is performed on the greytone photoresist layer 103. The greytonephotolithography process can include applying radiation R through agreytone mask M to expose the greytone photoresist layer 103 to theradiation R. The greytone mask M is a mask that is configured to allowvarying amounts of radiation to pass through different portions of themask M when the different portions of the mask (i.e., different portionsin the XY plane of the mask) are exposed to radiation having the sameproperties (e.g., intensity, wavelength, frequency, duration, etc.). Thevarying amount of radiation R directed through the greytone mask Menables the greytone photoresist layer 103 to be altered to varyingdepths in the Z-direction.

After exposure of portions of the greytone photoresist layer 103 toradiation R using the greytone mask M, the greytone photoresist layer103 can be developed to remove portions of the greytone photoresistlayer 103, such as the uncured portions of the photoresist layer 103.Removal of these portions the greytone photoresist layer 103 leaves aplurality of patterned features 103P as shown in FIG. 2B.

At block 1006, with reference to FIG. 2C, the patterned features 103P ofthe photoresist layer 103 and the underlying dielectric layer 102 can beetched back to form a plurality of patterned features 102P that areformed of portions of the dielectric layer 102. In some embodiments, thepatterned features 102P have a same shape and size and can be arrangedin a same pattern as the patterned features 103P of the photoresistlayer 103. In some embodiments, the patterned features 102P of thedielectric layer 102 can be more suitable for subsequent processing thanthe patterned features 103P of the photoresist layer 103. For example,the patterned features 102P of the dielectric layer 102 can be moredurable and can have properties that are more suitable for releasingfrom other materials, such as imprint material described below, than thecorresponding patterned features 103P of the photoresist layer 103.

At block 1008, with reference to FIG. 2D, the master 100 with thepatterned features 102P can be used imprint patterned features 112P on atemplate 110. In some embodiments, the patterned features 112P can be amirror image of the patterned features 102P of the master 100. Thetemplate 110 can include a base 111 and an imprint layer 112 formed ofan imprintable material. In one embodiment, the imprint layer 112 can bean imprint resist (i.e., a material that can retain an imprinted patternand in some embodiments the material can be configured to be cured afterthe imprinting).

At block 1010, with reference to FIG. 2E, the imprint template 110 isreleased from the master 100. After release the patterned features 112Pcan be cured (e.g., UV cure) for subsequent processing.

At block 1012, with reference to FIG. 2F, an imprint resist material isapplied over a dielectric layer 122 of an optical device 120 to form animprint resist layer 123. The dielectric layer 122 can be disposed overa substrate 121 of the optical device 120. In some embodiments, thesubstrate 121 can be formed of silicon, quartz, or any other materialcommonly used as substrates for optical devices. In some embodiments,the dielectric layer 122 can be formed of silicon oxide or otherdielectric layer.

At block 1014, with reference to FIG. 2G, the patterned features 112P ofthe imprint template 110 can be used to imprint the imprint resist layer123 of the optical device 120 and form patterned features 123P in theimprint resist layer 123.

At block 1016, with reference to FIG. 2H, the imprint template 110 isreleased from the optical device 120. After release the patternedfeatures 123P can be cured (e.g., UV cure) for subsequent processing.

At block 1018, with reference to FIG. 2I, the patterned features 123P ofthe imprint resist layer 123 and the underlying dielectric layer 122 canbe etched back to form a plurality of patterned features 122P that areformed of portions of the dielectric layer 122. In some embodiments, thepatterned features 122P of the dielectric layer 122 can be componentsthat are configured to transport light through the optical device 120.For example, in one embodiment the patterned features 122P of theoptical device can be or include optical gratings of a waveguidecombiner to be used in an augmented reality device.

In some embodiments, the patterned features 122P have a same shape andsize and can be arranged in a same pattern as the patterned features123P of the resist layer 123. Furthermore, the patterned features 122Pcan also have a same shape and size and can be arranged in a samepattern as the patterned features 102P of the master 100, for example asshown in FIG. 2C. Although the patterned features 122P of the opticaldevice 120 can be the same as or highly similar to the patternedfeatures 102P of the master 100, the patterned features 122P of theoptical device 120 can be consistently and accurately formed by usingthe imprint template 110 while the greytone photolithography processused to form the patterned features 102P of the master 100 generatessubstantially less consistent results when the greytone photolithographyprocess is repeated. The following disclosure describes processes usinggreytone photolithography and imprint lithography to consistently formpatterns on optical devices.

FIG. 3 is a process flow diagram of a method 3000 of imprinting apattern on an optical device 120 as shown in FIG. 4I, according to oneembodiment. The optical device 120 can be the same optical device 120described above with reference to FIGS. 1 and 2A-2I. Furthermore, themethod 3000 includes many of the same operations as the method 1000described above.

FIGS. 4A-4I show different stages of the method 3000 for forming thepattern on the optical device 120. The method 3000 is described withreference to FIG. 3 and FIGS. 4A-4I as well as additional reference toFIGS. 1 and 2A-2I.

FIG. 4A is a top view of three masters 100 ₁₋₃. FIG. 4B is a partialcross-sectional view of a first master 100 ₁ taken along section line 4Bof FIG. 4A. Each master 100 includes the patterned features 102P shownin FIG. 4B. The patterned features 102P are formed over the substrate101 of each master 100. The patterned features 102P are the samepatterned features 102P described above in reference to FIG. 2C. Threemasters 100 ₁-100 ₃ are shown in FIG. 4A, but two or more masters 100can be used for the method 3000. With the exception of patterndifferences relating to how accurately the patterned features 102P areformed on each individual master 100, each master 100 in FIG. 4A can thesame as the other masters 100 in FIG. 4A as well as the same as themaster 100 described above in reference to FIGS. 1 and 2A-2I.

Each master 100 includes a plurality of die 104 (i.e., eachsquare-shaped region on each master 100 in FIG. 4A). Each die 104 oneach master 100 can include a plurality of patterned features 102P asshown in FIG. 4B. For this illustration, each die 104 corresponds tothree of the six triangular-shaped regions in FIG. 4B.

The method 3000 begins at block 3002. At block 3002, with reference toFIGS. 4A and 4B, the plurality of patterned features 102P are formed oneach of the plurality of masters 100. The patterned features 102P can beformed on each master 100 using a method other than imprinting, such asmethods using one or more of etching and/or non-imprint lithographyprocesses (e.g., lithography using one or more forms of radiation orelectron beam). In one embodiment, the greytone photolithography andetching process described above in reference to blocks 1002-1006 andFIGS. 2A-2C can be performed on each master 100 in FIG. 4A to form thepatterned features 102P on each master 100.

At block 3004, with reference to FIGS. 4A and 4C, a metrology process isperformed on each master 100, and a first master 100 ₁ of the threemasters 100 ₁₋₃ is selected for subsequent processing as shown in FIG.4C. For example, based on the measurements performed during themetrology process at block 3004, the master 100 having measurements mostaligned with target measurements for a predetermined design can bechosen for subsequent processing. Various criteria can be used todetermine which master 100 to choose. For example, in one embodiment,the master 100 having the least amount of variation of height in theZ-direction for the patterned features 102P from the intended structureheight at various measurement locations (e.g., across 100 differentlocations on each master 100 or 100 different locations on each die 104on each master 100) can be chosen as the most suitable master 100 foradditional processing. In other embodiments, other measurements, such asstructure width and structure position on the master can also beincluded for determining which master is the most suitable.

At block 3006, with reference to FIGS. 4D, 4E, and 4F, the selectedfirst master 100 ₁ is used to form the imprint template 110. The imprinttemplate 110 can be same imprint template 110 described above withreference to FIG. 1 and FIGS. 2A-2I. As described above, the imprinttemplate 110 includes the base 111 and the imprint layer 112.

As shown in FIG. 4D, the selected first master 100 ₁ can be used toimprint the patterned features 112P in the imprint layer 112 of theimprint template 110. As shown in FIG. 4E, the imprint template 110 isreleased from the first master 100 ₁.

FIG. 4F shows a top view of the whole imprint template 110. The imprinttemplate 110 can include die 114 (i.e., the square-shaped regions inFIG. 4F) arranged in a similar pattern to the die 104 described above inreference to FIG. 4A. Each die 114 can include the patterned features112P. The views of the template 110 in FIGS. 4D and 4E can be partialcross-sectional views of the imprint template 110 along section line 4Dof FIG. 4F.

At block 3008, with reference to FIGS. 4G, 4H, and 4I, the imprinttemplate 110 can be used to form patterned features 122P (see FIG. 4H)on an optical device 120 (also referred to as substrates as the benefitsof this disclosure are not limited to optical devices). The patternedfeatures 122P can be formed on the optical device 120 in the same manneras described above in reference to blocks 1014-1018 of the method 1000shown in FIG. 1. As shown in FIG. 4G, the imprint template 110 can beused to form patterned features 123P in an imprint resist layer 123 ofthe optical device 120. Then, after the imprint template 110 isreleased, the patterned features 123P of the imprint resist layer 123and the underlying dielectric layer 122 can be etched back to form theplurality of patterned features 122P that are formed of portions of thedielectric layer 122 as shown in FIG. 4H.

FIG. 4I shows a top view of the whole optical device 120 formed usingthe method 3000. The optical device 120 can include die 124 (i.e., thesquare-shaped regions in FIG. 4I) arranged in a similar pattern to thedie 104 described above in reference to FIG. 4A. Each die 124 caninclude the patterned features 122P shown in FIG. 4H. The views of theoptical device 120 in FIGS. 4G and 4H can be partial cross-sectionalviews of the optical device 120 along section line 4G of FIG. 4I.

At block 3010, a determination is made as to whether a target number ofoptical devices 120 have been imprinted with the imprint template 110.Once the target number of optical devices 120 have been imprinted, themethod 3000 can end. On the other hand, if the target number of opticaldevices 120 have not been imprinted with the template 110, then theimprint template 110 can be repeatedly used (e.g., hundreds of times,thousands of times, etc.) by re-executing block 3008 to form additionaloptical devices 120 with the same patterned features 123P shown in FIG.4G and the patterned features 122P after the etching process as shown inFIG. 4H. By using the imprint template 110 to form the patternedfeatures 122P of numerous optical devices 120, the patterned features122P of the optical devices 120 can be formed with greater consistencyand accuracy compared to forming the patterned features 122P by usingother methods, such as forming the patterned features 122 using greytonephotolithography without imprinting.

FIG. 5 is a process flow diagram of a method 5000 of imprinting apattern on an optical device 120 shown in FIG. 6H, according to oneembodiment. The optical device 120 can be the same optical device 120described above with reference to FIGS. 1 and 2A-2I. Furthermore, themethod 5000 includes many of the same operations as the method 1000described above in reference to FIG. 1 and the method 3000 in referenceto FIG. 3.

FIGS. 6A-6H show different stages of the method 5000 for forming thepattern on the optical device 120. The method 5000 is described withreference to FIG. 5 and FIGS. 6A-6H as well as additional reference toFIGS. 1 and 2A-2I.

FIGS. 6A and 6B are the same as FIGS. 4A and 4B described above. A briefoverview of these Figures is provided here, and additional detail can befound above with reference to FIGS. 4A and 4B. FIG. 6A is a top view ofthree masters 100 ₁₋₃. FIG. 6B is a partial cross-sectional view of afirst master 100 ₁ taken along section line 6B of FIG. 6A. Each master100 includes a plurality of die 104 as shown in FIG. 6A. Each die 104 oneach master 100 can include a plurality of patterned features 102P asshown in FIG. 6B. As illustrated, each die 104 corresponds to three ofthe six triangular-shaped regions in FIG. 6B.

The method 5000 begins at block 5002. At block 5002, with reference toFIGS. 6A and 6B, the plurality of patterned features 102P are formed oneach of the plurality of masters 100. The patterned features 102P can beformed on each master 100 using a method other than imprinting, such asmethods using one or more of etching or non-imprint lithographyprocesses (e.g., lithography using one or more forms of radiation,electron beam, etc.). In one embodiment, the greytone photolithographyand etching process described above in reference to blocks 1002-1006 andFIGS. 2A-2C can be performed on each master 100 in FIG. 6A to form thepatterned features 102P on each die 104 of each master 100.

At block 5004, with reference to FIGS. 6A and 6C, a metrology process isperformed on each die 104 of each master 100, and a first die 104 ₁ ofthe first master 100 ₁ of the three masters 100 ₁₋₃ is selected forsubsequent processing. For example, based on the measurements performedduring the metrology process at block 5004, the die 104 ₁ can havemeasurements most aligned with target measurements for a predetermineddesign. Various criteria can be used to determine which die 104 tochoose. For example, in one embodiment, the die 104 having the leastamount of variation of height in the Z-direction for the patternedfeatures 102P from the intended structure height at various measurementlocations (e.g., across 100 different locations on each die 104 on eachmaster 100) can be chosen as the most suitable die 104 for additionalprocessing.

At block 5006, with reference to FIGS. 6D and 6E, the selected first die104 ₁ on the first master 100 ₁ is used to form an imprint template110A. The imprint template 110A can be same as the imprint template 110described above with reference to FIG. 3 and FIGS. 4A-4I except that theimprint template 110A is smaller having a size corresponding to thesingle die 104 ₁ as opposed to the size of the master 100. The imprinttemplate 110A includes the base 111 and the imprint layer 112.

As shown in FIG. 6D, the selected first die 104 ₁ of the first master100 ₁ can be used to imprint the patterned features 112P in the imprintlayer 112 of the imprint template 110A. As shown in FIG. 6E, the imprinttemplate 110A is released from the first master 100 ₁.

At block 5008, with reference to FIGS. 6F, 6G, and 6H, the imprinttemplate 110A can be used as part of the process to form patternedfeatures 122P (see FIG. 6G) on an optical device 120 (also referred toas substrates as the benefits of this disclosure are not limited tooptical devices). In some embodiments, the patterned features 122P canbe formed on the optical device 120 in the same manner as describedabove in reference to blocks 1014-1018 of the method 1000 shown inFIG. 1. As shown in FIG. 6F, the imprint template 110A can be used toform patterned features 123P on a portion of the imprint resist layer123 of the optical device 120.

At block 5010, with reference to FIG. 6F, a determination can be made asto whether another imprint should be performed on the current opticaldevice 120 with the imprint template 110A. Because the imprint template110A is based on the size of a single die (i.e., the first die 104 ₁) asdescribed above, forming patterns on an optical device 120 having asimilar size as the masters 100 is accomplished with numerous imprintswith the imprint template 110A. If another imprint is to be done on thecurrent optical device 120, then either the optical device 120 or theimprint template 110A is stepped in a direction (e.g., a horizontaldirection in the XY plane) and the next die-sized area of the imprintresist layer 123 is imprinted with the imprint template 110A. Thisprocess of stepping and imprinting other areas of the imprint resistlayer 123 with the imprint template 110A continues until all of thetarget portions of the imprint resist layer 123 are imprinted with theimprint template 110A.

Then, after the imprint template 110A is released from the final portionof the imprint resist layer 123, the patterned features 123P of theimprint resist layer 123 and the underlying dielectric layer 122 can beetched back to form the plurality of patterned features 122P that areformed of portions of the dielectric layer 122 as shown in FIG. 6G.

FIG. 6H shows a top view of the whole optical device 120 formed usingthe method 5000. The optical device 120 can include die 124 (i.e., thesquare-shaped regions in FIG. 6H) arranged in a similar pattern to thedie 104 described above in reference to FIG. 6A. Each die 124 caninclude the patterned features 122P. The view of the optical device 120in FIG. 6G can be a partial cross-sectional view of the optical device120 along section line 6G of FIG. 6H.

At block 5012, a determination is made as to whether a target number ofoptical devices 120 have been imprinted with the imprint template 110A.Once the target number of optical devices 120 have been imprinted, themethod 5000 can end. On the other hand, if the target number of opticaldevices 120 have not been imprinted with the template 110A, then theimprint template 110A can be repeatedly used (e.g., hundreds of times,thousands of times, etc.) by re-executing block 5008 and 5010 to formadditional optical devices 120 with the same patterned features 123Pshown in FIG. 6F and the same patterned features 122P after the etchingprocess as shown in FIG. 6G. By using the imprint template 110A to formthe patterned features 122P of numerous optical devices 120, thepatterned features 122P of the optical devices 120 can be formed withgreater consistency and accuracy compared to forming the patternedfeatures 122P by using other methods, such as using greytonephotolithography without imprint lithography.

FIG. 7 is a process flow diagram of a method 7000 of imprinting apattern on an optical device 120 as shown in FIG. 8N, according to oneembodiment. The optical device 120 can be the same optical device 120described above with reference to FIGS. 1 and 2A-2I. Furthermore, themethod 7000 includes many of the same operations as the method 1000described above in reference to FIG. 1, the method 3000 described abovein reference to FIG. 3, and the method 5000 described above in referenceto FIG. 5.

FIGS. 8A-8N show different stages of the method 7000 for forming thepattern on the optical device 120. The method 7000 is described withreference to FIG. 7 and FIGS. 8A-8N as well as additional reference toFIGS. 1 and 2A-2I.

FIGS. 8A and 8B are the same as FIGS. 4A and 4B described above. A briefoverview of these Figures is provided here, and additional detail can befound above with reference to FIGS. 4A and 4B. FIG. 8A is a top view ofthree masters 100 ₁₋₃. FIG. 8B is a partial cross-sectional view of afirst master 100 ₁ taken along section line 8B of FIG. 8A. Each master100 includes a plurality of die 104 as shown in FIG. 8A. Each die 104 oneach master 100 can include a plurality of patterned features 102P asshown in FIG. 8B. As illustrated, each die 104 corresponds to three ofthe six triangular-shaped regions in FIG. 8B.

The method 7000 begins at block 7002. At block 7002, with reference toFIGS. 8A and 8B, the plurality of patterned features 102P are formed oneach of the plurality of masters 100. The patterned features 102P can beformed on each master 100 using a method other than imprinting, such asmethods using one or more etching and/or non-imprint lithographyprocesses (e.g., lithography using one or more forms of radiation,electron beam, etc.). In one embodiment, the greytone photolithographyand etching process described above in reference to blocks 1002-1006 andFIGS. 2A-2C can be performed on each master 100 in FIG. 8A to form thepatterned features 102P on each master 100.

At block 7004, with reference to FIGS. 8A and 8C, a metrology process isperformed on each die 104 of each master 100, and a first die 104 ₁ ofthe first master 100 ₁ of the three masters 100 ₁₋₃ is selected forsubsequent processing. For example, based on the measurements performedduring the metrology process at block 7004, the first die 104 ₁ can havemeasurements most aligned with target measurements for a predetermineddesign. Various criteria can be used to determine which die 104 tochoose. For example, in one embodiment, the die 104 having the leastamount of variation of height in the Z-direction for the patternedfeatures 102P from the intended structure height at various measurementlocations (e.g., across 100 different locations on each die 104 on eachmaster 100) can be chosen as the most suitable die 104 for additionalprocessing.

At block 7006, with reference to FIGS. 8D and 8E, the selected first die104 ₁ on the first master 100 ₁ is used to form the imprint template110A. The imprint template 110A can be same as the imprint template 110described above with reference to FIG. 3 and FIGS. 4A-4I except that theimprint template 110A is smaller having a size corresponding to a singledie (i.e., the first die 104 ₁) as opposed to the size of the master100. The imprint template 110A includes the base 111 and the imprintlayer 112.

As shown in FIG. 8D, the selected first die 104 ₁ of the first master100 ₁ can be used to imprint the patterned features 112P in the imprintlayer 112 of the imprint template 110A. As shown in FIG. 8E, the imprinttemplate 110A is released from the first master 100 ₁.

At block 7008, with reference to FIG. 8F, the imprint template 110A canbe used to form patterned features 123P on a portion of the imprintresist layer 123 of a new master 120N. In some embodiments, the newmaster 120N can be the same as or include the same materials as theoptical device 120 described above. In other embodiments, the new master120N can include some of the materials used for the original master 100,such as the substrate 101 and the dielectric layer 102 from the master100 along with the imprint resist layer 123 from the optical device 120.In other embodiments, the new master 120N can include one or morematerials not used in either of the master 100 or the optical device120.

At block 7010, with reference to FIG. 8F, a determination can be made asto whether another imprint should be performed on the new master 120Nwith the imprint template 110A. Because the imprint template 110A isbased on the size of a single die 104 ₁ as described above, formingpatterns on the new master 120N having a similar size as the masters 100is accomplished with numerous imprints on the imprint resist layer 123of the new master 120N with the imprint template 110A. If anotherimprint is to be done on the new master 120N, then either the new master120N or the imprint template 110A is stepped in a direction (e.g., ahorizontal direction in the XY plane) and the next area of the imprintresist layer 123 is imprinted with the imprint template 110A. Thisprocess of stepping and imprinting other areas of the imprint resistlayer 123 of the new master 120N with the imprint template 110Acontinues until all of the target portions of the imprint resist layer123 of the new master 120N are imprinted with the imprint template 110A.

Then, after the imprint template 110A is released from the final portionof the imprint resist layer 123 of the new master 120N, the patternedfeatures 123P of the imprint resist layer 123 and the underlyingdielectric layer 122 can be etched back to form the plurality ofpatterned features 122P that are formed of portions of the dielectriclayer 122 as shown in FIG. 8G.

FIG. 8H shows a top view of the completed new master 120N. The newmaster 120N can include a plurality of die 124 arranged in the samepattern as the plurality of die 104 included in the first master 100 ₁.The plurality of patterned features 122P in the new master 120N haveless variation from the intended design than the plurality of patternedfeatures 102P of the first master 100 ₁ because each die 124 in the newmaster 120N is based off of an imprint derived using a template 110Aformed from the first die 104 ₁ with the least amount of variation fromthe intended design out of all of the die 104 for all three of theoriginal masters 100 ₁₋₃.

At block 7012, with reference to FIGS. 8I, 8J, and 8K, the new master120N is used to form a new imprint template 110N. The new imprinttemplate 110N can be same as the imprint template 110 described abovewith reference to FIG. 1 and FIGS. 2A-2I. As described above, theimprint template 110N includes the base 111 and the imprint layer 112.

As shown in FIG. 8I, the new master 120N can be used to imprint thepatterned features 112P in the imprint layer 112 of the new imprinttemplate 110N. As shown in FIG. 8J, the new imprint template 110N isreleased from the new master 120N.

FIG. 8K shows a top view of the whole new imprint template 110N. The newimprint template 110N can include die 114 (i.e., the square-shapedregions in FIG. 8K) arranged in a similar pattern to the die 104 of themaster 100 described above in reference to FIG. 8A. Each die 114 caninclude the patterned features 112P. The views of the template 110N inFIGS. 8I and 8J can be partial cross-sectional views of the new imprinttemplate 110N along section line 8J of FIG. 8K. The patterned features112P in each die 114 of the template 110N can be the same as thepatterned features 112P in the template 110A of FIG. 8E, but the largersize of the new imprint template 110N allows the new imprint template110N to imprint optical devices (e.g., optical device 120) more quicklythan the smaller imprint template 110A shown in FIG. 8E.

At block 7014, with reference to FIGS. 8L and 8M, the new imprinttemplate 110N can be used as part of the process to form patternedfeatures 122P (see FIG. 8M) on an optical device 120 (also referred toas substrate as the benefits of this disclosure are not limited tooptical devices). The patterned features 122P can be formed on theoptical device 120 in the same manner as described above in reference toblocks 1014-1018 of the method 1000 shown in FIG. 1. As shown in FIG.8L, the new imprint template 110N can be used to form patterned features123P in an imprint resist layer 123 of the optical device 120. Then,after the new imprint template 110N is released, the patterned features123P of the imprint resist layer 123 and the underlying dielectric layer122 can be etched back to form the plurality of patterned features 122Pthat are formed of portions of the dielectric layer 122 as shown in FIG.8M.

FIG. 8N shows a top view of the whole optical device 120 formed usingthe method 7000. The optical device 120 can include die 124 (i.e., thesquare-shaped regions in FIG. 8N) arranged in a similar pattern to thedie 104 described above in reference to FIG. 8A. Each die 124 caninclude the patterned features 122P. The views of the optical device 120in FIGS. 8L and 8M can be partial cross-sectional views of the opticaldevice 120 along section line 8L of FIG. 8N.

At block 7016, a determination is made as to whether a target number ofoptical devices 120 have been imprinted with the new imprint template110N. Once the target number of optical devices 120 have been imprinted,the method 7000 can end. On the other hand, if the target number ofoptical devices 120 have not been imprinted with the new imprinttemplate 110N, then the new imprint template 110N can be repeatedly used(e.g., hundreds of times, thousands of times, etc.) by re-executingblock 7014 to form additional optical devices 120 with the samepatterned features 123P shown in FIG. 8L and the same patterned features122P after the etching process as shown in FIG. 8M. By using the newimprint template 110N to form the patterned features 122P of numerousoptical devices 120, the patterned features 122P of the optical devices120 can be formed with greater consistency and accuracy compared toforming the patterned features 122P by using other methods, such asgreytone photolithography without the use of imprint lithography.

Although the methods 5000 (FIG. 5) and 7000 (FIG. 7) are described asperforming measurements on a plurality of masters to select a single die(e.g., the first die 104 ₁), in some embodiments the measurements forthese methods can be performed on a single master including two or moredie to select a die that most closely matches the design. Furthermore,because the methods 5000 and 7000 use the smaller imprint template 110Aas part of the process, there is no requirement that the final device(e.g., optical device 120) have a same size as the original master 100as the smaller imprint template 110A can be used to apply the pattern toother masters or devices having a variety of sizes and/or shapes.

Although the above mainly describes forming patterns on optical devices,the benefits of the disclosure can be applied to any device or processthat is used to imprint patterns. For example, the disclosure canprovide benefits to any process that uses imprint lithography, such asuse of imprint lithography in the semiconductor industry.

While the foregoing is directed to embodiments of the presentdisclosure, other and further embodiments of the disclosure may bedevised without departing from the basic scope thereof, and the scopethereof is determined by the claims that follow.

What is claimed is:
 1. A method of imprinting a pattern on a substrate,the method comprising: forming a first pattern on a plurality of mastersusing a method other than imprinting, the first pattern including aplurality of patterned features of varying sizes; measuring thepatterned features at a plurality of locations on each of the masters;selecting a first master of the plurality of masters based on themeasurements of the patterned features on each of the masters; using thefirst master to form a second pattern on an imprint template; andimprinting the first pattern on a first device with the imprinttemplate.
 2. The method of claim 1, wherein the first pattern is formedon the plurality of masters using greytone photolithography.
 3. Themethod of claim 1, further comprising imprinting the first pattern on aplurality of devices other than the first device with the imprinttemplate.
 4. The method of claim 1, wherein each master includes aplurality of die spaced apart from each other, and using the firstmaster to form to form the second pattern on the imprint templatecomprises imprinting the pattern from each die on the imprint templatesimultaneously.
 5. The method of claim 1, wherein each master includes aplurality of die spaced apart from each other, and measuring thepatterned features at a plurality of locations on each of the masterscomprises performing measurements of the plurality of patterned featureson each of the die.
 6. The method of claim 1, further comprising usingthe first pattern formed on the first master to form a plurality ofpatterned features on an optical device.
 7. The method of claim 6,wherein the plurality of patterned features of the optical device are aplurality of optical gratings of a waveguide combiner.
 8. A method ofimprinting a pattern on a substrate, the method comprising: forming afirst pattern on a plurality of die on each of a plurality of mastersusing a method other than imprinting, the first pattern on each dieincluding a plurality of patterned features of varying sizes; measuringthe patterned features at a plurality of locations on each die on eachof the masters; selecting a first die on a first master of the pluralityof masters based on the measurements of the patterned features on eachdie of each of the masters; using the first die on the first master toform a second pattern on an imprint template; and imprinting the firstpattern on a first die of a first device with the imprint template. 9.The method of claim 8, further comprising imprinting the first patternon a second die of the first device with the imprint template.
 10. Themethod of claim 8, wherein the first pattern is formed on the pluralityof masters using greytone photolithography.
 11. The method of claim 8,further comprising imprinting the first pattern on a plurality ofdevices other than the first device with the imprint template.
 12. Themethod of claim 8, further comprising using the first pattern formed onthe first master to form a plurality of patterned features on an opticaldevice.
 13. The method of claim 12, wherein the plurality of patternedfeatures of the optical device are a plurality of optical gratings of awaveguide combiner.
 14. The method of claim 8, wherein the first die ofthe first master is selected based on the measurements of the patternedfeatures of the first die having a least amount of variance from anintended design out of all of the die on all of the plurality ofmasters.
 15. A method of imprinting a pattern on a substrate, the methodcomprising: forming a first pattern on a plurality of die on each of aplurality of masters using a method other than imprinting, the firstpattern on each die including a plurality of patterned features ofvarying sizes; measuring the patterned features at a plurality oflocations on each die on each of the masters; selecting a first die on afirst master of the plurality of masters based on the measurements ofthe patterned features on each die of each of the masters; using thefirst die on the first master to form a second pattern on a firstimprint template; imprinting the first pattern on each die of aplurality of die of a new master with the first imprint template; usingthe plurality of die on the new master to form the second pattern oneach die of a plurality of die on a second imprint template; andimprinting the first pattern on a plurality of die on a first devicewith the second imprint template.
 16. The method of claim 15, whereinthe first pattern is formed on the plurality of masters using greytonephotolithography.
 17. The method of claim 15, further comprisingimprinting the first pattern on a plurality of devices other than thefirst device with the second imprint template.
 18. The method of claim15, further comprising using the first pattern formed on the firstmaster to form a plurality of patterned features on an optical device.19. The method of claim 18, wherein the plurality of patterned featuresof the optical device are a plurality of optical gratings of a waveguidecombiner.
 20. The method of claim 15, wherein the first die of the firstmaster is selected based on the measurements of the patterned featuresof the first die having a least amount of variance from an intendeddesign out of all of the die on all of the plurality of masters.